Due to the increasing demand for compact electronic devices, miniaturization of integrated circuits (IC) following Moore’s Law has long been the central focus of the semiconductor industry. Electronic packaging technology, located at the latter part of the semiconductor manufacturing process, serves as the final puzzle of seeking such demand. This course aims to give a comprehensive introduction on electronic packaging technologies, encompassing the interconnect hierarchy from chip-scale to system integration levels, the materials in electronic packaging, the validation methods for the package system to evaluate reliability from a scientific point of view through failure analysis, and the current developing trend in this industry.(more…..)
